Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module

In high-integration electronic components, the insulated-gate bipolar transistor (IGBT) power module has a high working temperature, which requires reasonable thermal analysis and a cooling process to improve the reliability of the IGBT module. This paper presents an investigation into the heat diss...

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Detalles Bibliográficos
Autores principales: Xu, Hanyang, Huang, Jiabo, Tian, Wenchao, Li, Zhao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456581/
https://www.ncbi.nlm.nih.gov/pubmed/37630033
http://dx.doi.org/10.3390/mi14081498

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456581/
https://www.ncbi.nlm.nih.gov/pubmed/37630033
http://dx.doi.org/10.3390/mi14081498

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