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Process Analysis and Topography Evaluation for Monocrystalline Silicon Laser Cutting-Off
Due to the characteristics of high brittleness and low fracture toughness of monocrystalline silicon, its high precision and high-quality cutting have great challenges. Aiming at the urgent need of wafer cutting with high efficiency, this paper investigates the influence law of different laser proce...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456582/ https://www.ncbi.nlm.nih.gov/pubmed/37630080 http://dx.doi.org/10.3390/mi14081542 |