A Simulation of Thermal Management Using a Diamond Substrate with Nanostructures

In recent years, the rapid progress in the field of GaN-based power devices has led to a smaller chip size and increased power usage. However, this has given rise to increasing heat aggregation, which affects the reliability and stability of these devices. To address this issue, diamond substrates w...

Descripción completa

Detalles Bibliográficos
Autores principales: Liu, Tingting, Zheng, Kaiwen, Tao, Tao, Hu, Wenxiao, Chen, Kai, Zhi, Ting, Ye, Yucong, Xie, Zili, Yan, Yu, Liu, Bin, Zhang, Rong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456886/
https://www.ncbi.nlm.nih.gov/pubmed/37630095
http://dx.doi.org/10.3390/mi14081559

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10456886/
https://www.ncbi.nlm.nih.gov/pubmed/37630095
http://dx.doi.org/10.3390/mi14081559

Ejemplares similares