A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning c...

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Detalles Bibliográficos
Autores principales: Doddapaneni, V. Vinay K., Lee, Kijoon, Aysal, Havva Eda, Paul, Brian K., Pasebani, Somayeh, Sierros, Konstantinos A., Okwudire, Chinedum E., Chang, Chih-hung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459285/
https://www.ncbi.nlm.nih.gov/pubmed/37630889
http://dx.doi.org/10.3390/nano13162303

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459285/
https://www.ncbi.nlm.nih.gov/pubmed/37630889
http://dx.doi.org/10.3390/nano13162303

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