Research Advances of Porous Polyimide—Based Composites with Low Dielectric Constant

With the burgeoning of the microelectronics industry, in order to improve the transmission speed between chips in large-scale integrated circuits to meet the demands of high integration, it is necessary for interlayer insulation materials to possess a lower dielectric constant (k). Polyimide (PI) ha...

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Detalles Bibliográficos
Autores principales: Pang, Zhenjiang, Sun, Hengchao, Guo, Yan, Du, Jun, Li, Liang, Li, Qiuyang, Yang, Junzhong, Zhang, Jijun, Wu, Weiguo, Yang, Sen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459409/
https://www.ncbi.nlm.nih.gov/pubmed/37631398
http://dx.doi.org/10.3390/polym15163341

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10459409/
https://www.ncbi.nlm.nih.gov/pubmed/37631398
http://dx.doi.org/10.3390/polym15163341

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