Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

[Image: see text] Due to the harsh working environments up to 600 °C, the exploration of high-temperature interconnection materials is significantly important for high-power devices. In this study, a hybrid paste including Cu@Ag core–shell microparticles (MPs) and Ag nanoparticles (NPs) was designed...

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Detalles Bibliográficos
Autores principales: Wu, Zhuohuan, Liu, Wei, Feng, Jiayun, Wen, Zhicheng, Zhang, Xinyue, Wang, Xinming, Wang, Chunqing, Tian, Yanhong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10468888/
https://www.ncbi.nlm.nih.gov/pubmed/37663465
http://dx.doi.org/10.1021/acsomega.3c02854

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10468888/
https://www.ncbi.nlm.nih.gov/pubmed/37663465
http://dx.doi.org/10.1021/acsomega.3c02854

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