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Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
The behavior of recrystallization and grain growth was examined in Cu-Cu joints during electromigration at 150 °C. Recrystallization and grain growth were observed in all the joints after electromigration for 9000 h. Voiding was formed in Cu current-feeding lines and in bonding interfaces, and resis...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10488382/ https://www.ncbi.nlm.nih.gov/pubmed/37687515 http://dx.doi.org/10.3390/ma16175822 |