A Printing Strategy for Embedding Conductor Paths into FFF Printed Parts

A novel approach to manufacture components with integrated conductor paths involves embedding and sintering an isotropic conductive adhesive (ICA) during fused filament fabrication (FFF). However, the molten plastic is deposited directly onto the adhesive path which causes an inhomogeneous displacem...

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Detalles Bibliográficos
Autores principales: Banko, Timo, Grünwald, Stefan, Kronberger, Rainer, Seitz, Hermann
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10489953/
https://www.ncbi.nlm.nih.gov/pubmed/37688124
http://dx.doi.org/10.3390/polym15173498

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10489953/
https://www.ncbi.nlm.nih.gov/pubmed/37688124
http://dx.doi.org/10.3390/polym15173498

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