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A Printing Strategy for Embedding Conductor Paths into FFF Printed Parts
A novel approach to manufacture components with integrated conductor paths involves embedding and sintering an isotropic conductive adhesive (ICA) during fused filament fabrication (FFF). However, the molten plastic is deposited directly onto the adhesive path which causes an inhomogeneous displacem...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10489953/ https://www.ncbi.nlm.nih.gov/pubmed/37688124 http://dx.doi.org/10.3390/polym15173498 |