Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application

Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu) bonding has become the preferred choice due to its excel...

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Detalles Bibliográficos
Autores principales: Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Hung, Tzu-Heng, Chen, Kuan-Neng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10489970/
https://www.ncbi.nlm.nih.gov/pubmed/37687000
http://dx.doi.org/10.3390/nano13172490

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10489970/
https://www.ncbi.nlm.nih.gov/pubmed/37687000
http://dx.doi.org/10.3390/nano13172490

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