Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO(2) Hybrid Joints

X-ray nanodiffraction was used to measure the thermal stress of 10 µm nanotwinned Cu bumps in Cu/SiO(2) hybrid structures at −55 °C, 27 °C, 100 °C, 150 °C, and 200 °C. Bonding can be achieved without externally applied compression. The X-ray beam size is about 100 nm in diameter. The Cu bump is domi...

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Detalles Bibliográficos
Autores principales: Hsu, Wei-You, Yang, Shih-Chi, Lin, You-Yi, Hsieh, Wan-Zhen, Tu, King-Ning, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chiang, Ching-Yu, Chen, Chih
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10490242/
https://www.ncbi.nlm.nih.gov/pubmed/37686957
http://dx.doi.org/10.3390/nano13172448

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10490242/
https://www.ncbi.nlm.nih.gov/pubmed/37686957
http://dx.doi.org/10.3390/nano13172448

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