Role of Oxygen in Amorphous Carbon Hard Mask Plasma Etching

[Image: see text] In the current and next-generation Si-based semiconductor manufacturing processes, amorphous carbon layer (ACL) hard masks are garnering considerable attention for high-aspect-ratio (HAR) etching due to their outstanding physical properties. However, a current limitation is the lac...

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Detalles Bibliográficos
Autores principales: Yeom, Hee-Jung, Yoon, Min Young, Choi, Daehan, Lee, Youngseok, Kim, Jung-Hyung, You, Shin-Jae, Lee, Hyo-Chang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10500572/
https://www.ncbi.nlm.nih.gov/pubmed/37720774
http://dx.doi.org/10.1021/acsomega.3c02438

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10500572/
https://www.ncbi.nlm.nih.gov/pubmed/37720774
http://dx.doi.org/10.1021/acsomega.3c02438

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