Wafer‐Level Manufacturing of MEMS H(2) Sensing Chips Based on Pd Nanoparticles Modified SnO(2) Film Patterns

In this manuscript, a simple method combining atomic layer deposition and magnetron sputtering is developed to fabricate high‐performance Pd/SnO(2) film patterns applied for micro‐electro‐mechanical systems (MEMS) H(2) sensing chips. SnO(2) film is first accurately deposited in the central areas of MEMS micro hotplate arrays by a mask‐assistant method, leading the patterns with wafer‐level high consistency in thickness. The grain size and density of Pd nanoparticles modified on the surface of the SnO(2) film are further regulated to obtain an optimized sensing performance. The resulting MEMS H(2) sensing chips show a wide detection range from 0.5 to 500 ppm, high resolution, and good repeatability. Based on the experiments and density functional theory calculations, a sensing enhancement mechanism is also proposed: a certain amount of Pd nanoparticles modified on the SnO(2) surface could bring stronger H(2) adsorption followed by dissociation, diffusion, and reaction with surface adsorbed oxygen species. Obviously, the method provided here is quite simple and effective for the manufacturing of MEMS H(2) sensing chips with high consistency and optimized performance, which may also find broad applications in other MEMS chip technologies.