A Study on the Interfacial Reactions between Gallium and Cu/Ni/Au(Pd) Multilayer Metallization

This research introduces low-temperature soldering of Ga with practical metallization structures, namely, Cu/Ni/Pd and Cu/Ni/Au, applied to contemporary microelectronic packages. Through these multilayer configurations, the study investigates the stability of the Ni diffusion barrier by examining ch...

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Detalles Bibliográficos
Autores principales: Kim, Byungwoo, Kim, Chang-Lae, Sohn, Yoonchul
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532968/
https://www.ncbi.nlm.nih.gov/pubmed/37763462
http://dx.doi.org/10.3390/ma16186186

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532968/
https://www.ncbi.nlm.nih.gov/pubmed/37763462
http://dx.doi.org/10.3390/ma16186186

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