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Investigation of the Fabrication of Diamond/SiC Composites Using α-Si(3)N(4)/Si Infiltration
Diamond/SiC (Dia/SiC) composites possess excellent properties, such as high thermal conductivity and low thermal expansion coefficient. In addition, they are suitable as electronic packaging materials. This study mainly optimized the diamond particle size packing and liquid-phase silicon infiltratio...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532997/ https://www.ncbi.nlm.nih.gov/pubmed/37763530 http://dx.doi.org/10.3390/ma16186252 |