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Investigation of the Fabrication of Diamond/SiC Composites Using α-Si(3)N(4)/Si Infiltration

Diamond/SiC (Dia/SiC) composites possess excellent properties, such as high thermal conductivity and low thermal expansion coefficient. In addition, they are suitable as electronic packaging materials. This study mainly optimized the diamond particle size packing and liquid-phase silicon infiltratio...

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Detalles Bibliográficos
Autores principales:	Xing, Bo, Zhang, Yingfan, Zhao, Jinzhui, Wang, Jianyu, Huang, Guoqin
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10532997/ https://www.ncbi.nlm.nih.gov/pubmed/37763530 http://dx.doi.org/10.3390/ma16186252

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