Thermal Stability of Cu-Al-Ni Shape Memory Alloy Thin Films Obtained by Nanometer Multilayer Deposition

Cu-Al-Ni is a high-temperature shape memory alloy (HTSMA) with exceptional thermomechanical properties, making it an ideal active material for engineering new technologies able to operate at temperatures up to 200 °C. Recent studies revealed that these alloys exhibit a robust superelastic behavior a...

Descripción completa

Detalles Bibliográficos
Autores principales: Gómez-Cortés, Jose F., Nó, María L., Chuvilin, Andrey, Ruiz-Larrea, Isabel, San Juan, Jose M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10535951/
https://www.ncbi.nlm.nih.gov/pubmed/37764633
http://dx.doi.org/10.3390/nano13182605

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10535951/
https://www.ncbi.nlm.nih.gov/pubmed/37764633
http://dx.doi.org/10.3390/nano13182605

Ejemplares similares