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Investigation of the Connection Schemes between Decks in 3D NAND Flash
Dual-deck stacking technology is an effective solution for solving the contradiction between the demand for increasing storage layers and the challenge of the deep hole etching process in 3D NAND flash. The connection scheme between decks is a key technology for the dual-deck structure. It has becom...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10536591/ https://www.ncbi.nlm.nih.gov/pubmed/37763942 http://dx.doi.org/10.3390/mi14091779 |