Cargando…
Thermal Characterization of Metal-Diamond Composite Heat Spreaders Using Low-Frequency-Domain Thermoreflectance
[Image: see text] High thermal conductivity and an appropriate coefficient of thermal expansion are the key features of a perfect heat spreader for electronic device packaging, especially for applications with increased power density and the increasing demand for higher reliability and semiconductor...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2023
|
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10538502/ https://www.ncbi.nlm.nih.gov/pubmed/37779888 http://dx.doi.org/10.1021/acsaelm.3c00771 |