Atomistic insights into adhesion characteristics of tungsten on titanium nitride using steered molecular dynamics with machine learning interatomic potential

As transistor integration accelerates and miniaturization progresses, improving the interfacial adhesion characteristics of complex metal interconnect has become a major issue in ensuring semiconductor device reliability. Therefore, it is becoming increasingly important to interpret the adhesive pro...

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Detalles Bibliográficos
Autores principales: Cho, Eunseog, Son, Won-Joon, Cho, Eunae, Jang, Inkook, Kim, Dae Sin, Min, Kyoungmin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10564797/
https://www.ncbi.nlm.nih.gov/pubmed/37816762
http://dx.doi.org/10.1038/s41598-023-44265-6

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10564797/
https://www.ncbi.nlm.nih.gov/pubmed/37816762
http://dx.doi.org/10.1038/s41598-023-44265-6

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