A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength

Multilayer electroforming has a high potential to produce Ni/Ni layer structured metal walls with excellent material properties and a high thickness uniformity. However, Ni is easily oxidized in air, which fundamentally leads to a low adhesion strength between the Ni layers. Here, a novel in situ tr...

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Detalles Bibliográficos
Autores principales: Wang, Zhuangzhuang, Shen, Chunjian, Ma, Zhou, Zhu, Zengwei, Zhu, Di
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10573967/
https://www.ncbi.nlm.nih.gov/pubmed/37834642
http://dx.doi.org/10.3390/ma16196504

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10573967/
https://www.ncbi.nlm.nih.gov/pubmed/37834642
http://dx.doi.org/10.3390/ma16196504

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