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A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength
Multilayer electroforming has a high potential to produce Ni/Ni layer structured metal walls with excellent material properties and a high thickness uniformity. However, Ni is easily oxidized in air, which fundamentally leads to a low adhesion strength between the Ni layers. Here, a novel in situ tr...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10573967/ https://www.ncbi.nlm.nih.gov/pubmed/37834642 http://dx.doi.org/10.3390/ma16196504 |