A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies....

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Detalles Bibliográficos
Autores principales: Nimbalkar, Pratik, Bhaskar, Pragna, Kathaperumal, Mohanalingam, Swaminathan, Madhavan, Tummala, Rao R.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10575375/
https://www.ncbi.nlm.nih.gov/pubmed/37835944
http://dx.doi.org/10.3390/polym15193895

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10575375/
https://www.ncbi.nlm.nih.gov/pubmed/37835944
http://dx.doi.org/10.3390/polym15193895

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