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A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates
The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies....
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10575375/ https://www.ncbi.nlm.nih.gov/pubmed/37835944 http://dx.doi.org/10.3390/polym15193895 |