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Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin
Epoxy thermal conductive adhesives with high thermal conductivity and dynamic mechanical properties are important thermally conductive materials for fabricating highly integrated electronic devices. In this paper, micro-Al(2)O(3) is used as a thermally conductive filler for the epoxy resin composite...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Public Library of Science
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10575537/ https://www.ncbi.nlm.nih.gov/pubmed/37831678 http://dx.doi.org/10.1371/journal.pone.0292878 |