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Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin

Epoxy thermal conductive adhesives with high thermal conductivity and dynamic mechanical properties are important thermally conductive materials for fabricating highly integrated electronic devices. In this paper, micro-Al(2)O(3) is used as a thermally conductive filler for the epoxy resin composite...

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Detalles Bibliográficos
Autores principales:	Xu, Zhe, Zhang, Cheng, Li, Yang, Zou, Jun, Li, Yuefeng, Yang, Bobo, Hu, Rongrong, Qian, Qi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Public Library of Science 2023
Materias:	Research Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10575537/ https://www.ncbi.nlm.nih.gov/pubmed/37831678 http://dx.doi.org/10.1371/journal.pone.0292878

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