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Copper Sintering Pastes with Various Polar Solvents and Acidic Activators

[Image: see text] Devices in the developing semiconductor market require high density, high integration, and detailed processing. Conventional wire bonding is inappropriate for fine-sized devices, and connected wires can be damaged by heat generation and external physical impact. Soldering is also u...

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Detalles Bibliográficos
Autores principales: Lee, Seungyeon, Han, Seong-ju, Kim, Yongjune, Jang, Keon-Soo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10601074/
https://www.ncbi.nlm.nih.gov/pubmed/37901574
http://dx.doi.org/10.1021/acsomega.3c04245