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Copper Sintering Pastes with Various Polar Solvents and Acidic Activators
[Image: see text] Devices in the developing semiconductor market require high density, high integration, and detailed processing. Conventional wire bonding is inappropriate for fine-sized devices, and connected wires can be damaged by heat generation and external physical impact. Soldering is also u...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10601074/ https://www.ncbi.nlm.nih.gov/pubmed/37901574 http://dx.doi.org/10.1021/acsomega.3c04245 |