Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration †

As the power electronics landscape evolves, pushing for greater vertical integration, capillary underfilling is considered a versatile encapsulation technique suited for iterative development cycles of innovative integration concepts. Since a defect-free application is critical, this study proposes...

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Detalles Bibliográficos
Autores principales: Stencel, Lisa Christin, Strogies, Jörg, Müller, Bernd, Knofe, Rüdiger, Borwieck, Carsten, Heimann, Matthias
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609424/
https://www.ncbi.nlm.nih.gov/pubmed/37893322
http://dx.doi.org/10.3390/mi14101885

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609424/
https://www.ncbi.nlm.nih.gov/pubmed/37893322
http://dx.doi.org/10.3390/mi14101885

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