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Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration †
As the power electronics landscape evolves, pushing for greater vertical integration, capillary underfilling is considered a versatile encapsulation technique suited for iterative development cycles of innovative integration concepts. Since a defect-free application is critical, this study proposes...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609424/ https://www.ncbi.nlm.nih.gov/pubmed/37893322 http://dx.doi.org/10.3390/mi14101885 |