An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks

The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of nanometers to sub-microns in the IC back end of the line stack, which put stringent demands on the reliability of the device. In this paper, the relia...

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Detalles Bibliográficos
Autores principales: Li, Ganglong, Shi, Yidian, Tay, Andrew A. O., Long, Zhilin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609484/
https://www.ncbi.nlm.nih.gov/pubmed/37893390
http://dx.doi.org/10.3390/mi14101953

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609484/
https://www.ncbi.nlm.nih.gov/pubmed/37893390
http://dx.doi.org/10.3390/mi14101953

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