Direct Application of Carbon Nanotubes (CNTs) Grown by Chemical Vapor Deposition (CVD) for Integrated Circuits (ICs) Interconnection: Challenges and Developments

With the continuous shrinkage of integrated circuit (IC) dimensions, traditional copper interconnect technology is gradually unable to meet the requirements for performance improvement. Carbon nanotubes have gained widespread attention and research as a potential alternative to copper, due to their...

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Detalles Bibliográficos
Autores principales: Chu, Zhenbang, Xu, Baohui, Liang, Jie
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609618/
https://www.ncbi.nlm.nih.gov/pubmed/37887942
http://dx.doi.org/10.3390/nano13202791

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609618/
https://www.ncbi.nlm.nih.gov/pubmed/37887942
http://dx.doi.org/10.3390/nano13202791

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