Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

This study investigated the use of distributed optical fiber sensing to measure temperature and strain during thermomechanical processes in printed circuit board (PCB) manufacturing. An optical fiber (OF) was bonded to a PCB for simultaneous measurement of temperature and strain. Optical frequency-d...

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Detalles Bibliográficos
Autores principales: Leite, Tiago Maurício, Freitas, Cláudia, Magalhães, Roberto, Ferreira da Silva, Alexandre, Alves, José R., Viana, Júlio C., Delgado, Isabel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10610684/
https://www.ncbi.nlm.nih.gov/pubmed/37896659
http://dx.doi.org/10.3390/s23208565

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10610684/
https://www.ncbi.nlm.nih.gov/pubmed/37896659
http://dx.doi.org/10.3390/s23208565

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