Interconnect for Dense Electronically Scanned Antenna Array Using High-Speed Vertical Connector

We present the design and the performance evaluation of a new interconnect for large-scale densely packed electronically scanned antenna arrays that utilize a high-speed digital board-to-board vertical connector. The application targets microwave tissue, imaging in the frequency range from 3 GHz to...

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Detalles Bibliográficos
Autores principales: Valizade Shahmirzadi, Nooshin, Nikolova, Natalia K., Chen, Chih-Hung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10611025/
https://www.ncbi.nlm.nih.gov/pubmed/37896689
http://dx.doi.org/10.3390/s23208596

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10611025/
https://www.ncbi.nlm.nih.gov/pubmed/37896689
http://dx.doi.org/10.3390/s23208596

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