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Interconnect for Dense Electronically Scanned Antenna Array Using High-Speed Vertical Connector
We present the design and the performance evaluation of a new interconnect for large-scale densely packed electronically scanned antenna arrays that utilize a high-speed digital board-to-board vertical connector. The application targets microwave tissue, imaging in the frequency range from 3 GHz to...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10611025/ https://www.ncbi.nlm.nih.gov/pubmed/37896689 http://dx.doi.org/10.3390/s23208596 |