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A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test
With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature [Formula: see text] is researched in this paper. This flow sensor consists of two par...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10650100/ https://www.ncbi.nlm.nih.gov/pubmed/37960433 http://dx.doi.org/10.3390/s23218733 |
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author | Kang, Qiaoqiao Lin, Yuzhe Tao, Jifang |
author_facet | Kang, Qiaoqiao Lin, Yuzhe Tao, Jifang |
author_sort | Kang, Qiaoqiao |
collection | PubMed |
description | With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature [Formula: see text] is researched in this paper. This flow sensor consists of two parts, a sensor chip and a signal-processing system (SPS). Firstly, the step-stress accelerated degradation test (SSADT) is implemented. The sensor chip and the flow sensor system are tested. The results show that the biggest drift is 3.15% for sensor chips under 150 °C testing conditions, while 32.91% is recorded for the flowmeters. So, the attenuation of the SPS is significant to the degeneration of this flowmeter. The minimum drift of the SPS accounts for 82.01% of this flowmeter. Secondly, using the Coffin–Manson model, the relationship between the cycle index and [Formula: see text] is established. The lifetime with a different [Formula: see text] is estimated using the Arrhenius model. In addition, Weibull distribution (WD) is applied to evaluate the lifetime distribution. Finally, the reliability function of the WD is demonstrated, and the survival rate within one year is 87.69% under 85 °C conditions. With the application of accelerated degradation testing (ADT), the acquired results are innovative and original. This research illustrates the reliability research, which provides a relational database for the application of this flow sensor. |
format | Online Article Text |
id | pubmed-10650100 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-106501002023-10-26 A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test Kang, Qiaoqiao Lin, Yuzhe Tao, Jifang Sensors (Basel) Communication With the wide application of flow sensors, their reliability under extreme conditions has become a concern in recent years. The reliability of a Micro Electro Mechanical Systems (MEMS) flow sensor under temperature [Formula: see text] is researched in this paper. This flow sensor consists of two parts, a sensor chip and a signal-processing system (SPS). Firstly, the step-stress accelerated degradation test (SSADT) is implemented. The sensor chip and the flow sensor system are tested. The results show that the biggest drift is 3.15% for sensor chips under 150 °C testing conditions, while 32.91% is recorded for the flowmeters. So, the attenuation of the SPS is significant to the degeneration of this flowmeter. The minimum drift of the SPS accounts for 82.01% of this flowmeter. Secondly, using the Coffin–Manson model, the relationship between the cycle index and [Formula: see text] is established. The lifetime with a different [Formula: see text] is estimated using the Arrhenius model. In addition, Weibull distribution (WD) is applied to evaluate the lifetime distribution. Finally, the reliability function of the WD is demonstrated, and the survival rate within one year is 87.69% under 85 °C conditions. With the application of accelerated degradation testing (ADT), the acquired results are innovative and original. This research illustrates the reliability research, which provides a relational database for the application of this flow sensor. MDPI 2023-10-26 /pmc/articles/PMC10650100/ /pubmed/37960433 http://dx.doi.org/10.3390/s23218733 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Communication Kang, Qiaoqiao Lin, Yuzhe Tao, Jifang A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title | A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title_full | A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title_fullStr | A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title_full_unstemmed | A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title_short | A Reliability Analysis of a MEMS Flow Sensor with an Accelerated Degradation Test |
title_sort | reliability analysis of a mems flow sensor with an accelerated degradation test |
topic | Communication |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10650100/ https://www.ncbi.nlm.nih.gov/pubmed/37960433 http://dx.doi.org/10.3390/s23218733 |
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