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Structural Electronic Skin for Conformal Tactile Sensing (Adv. Sci. 33/2023)

Structural Electronic Skin In article number 2304106, Sen Li, Tingrui Pan, Yu Chang, and co‐workers report a structural electronic skin (SES) engineered for conformal tactile sensing by utilizing the 3D printing technology to prepare the 3D electrode array in the structural component following its s...

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Detalles Bibliográficos
Autores principales: Li, Sen, Huang, Jiantao, Wang, Meilan, Deng, Ka, Guo, Chenhui, Li, Bin, Cheng, Yu, Sun, Hongyan, Ye, Hong, Pan, Tingrui, Chang, Yu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10667794/
http://dx.doi.org/10.1002/advs.202370227