Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness

One of the most important causes of the failure of power electronic modules is thermal stress. Proper thermal management plays an important role in more reliable and cost-effective energy conversion. In this paper, we present an advanced active thermal control (ATC) strategy to reduce a power device...

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Detalles Bibliográficos
Autores principales: Hu, Zhen, Wu, Xiaohua, Cui, Man
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10672831/
https://www.ncbi.nlm.nih.gov/pubmed/38004931
http://dx.doi.org/10.3390/mi14112075

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10672831/
https://www.ncbi.nlm.nih.gov/pubmed/38004931
http://dx.doi.org/10.3390/mi14112075

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