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Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness
One of the most important causes of the failure of power electronic modules is thermal stress. Proper thermal management plays an important role in more reliable and cost-effective energy conversion. In this paper, we present an advanced active thermal control (ATC) strategy to reduce a power device...
Autores principales: | Hu, Zhen, Wu, Xiaohua, Cui, Man |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10672831/ https://www.ncbi.nlm.nih.gov/pubmed/38004931 http://dx.doi.org/10.3390/mi14112075 |
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