An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate

Semiconductor chips on a substrate have a wide range of applications in electronic devices. However, environmental temperature changes may cause mechanical buckling of the chips, resulting in an urgent demand to develop analytical models to study this issue with high efficiency and accuracy such tha...

Descripción completa

Detalles Bibliográficos
Autores principales: Gong, Guangping, Xu, Dian, Xiong, Sijun, Yi, Fangyu, Wang, Chengbo, Li, Rui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673012/
https://www.ncbi.nlm.nih.gov/pubmed/38004881
http://dx.doi.org/10.3390/mi14112025

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673012/
https://www.ncbi.nlm.nih.gov/pubmed/38004881
http://dx.doi.org/10.3390/mi14112025

Ejemplares similares