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An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate
Semiconductor chips on a substrate have a wide range of applications in electronic devices. However, environmental temperature changes may cause mechanical buckling of the chips, resulting in an urgent demand to develop analytical models to study this issue with high efficiency and accuracy such tha...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673012/ https://www.ncbi.nlm.nih.gov/pubmed/38004881 http://dx.doi.org/10.3390/mi14112025 |