Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement sy...

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Detalles Bibliográficos
Autores principales: Tian, Fangxin, Wang, Tongqing, Lu, Xinchun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673209/
https://www.ncbi.nlm.nih.gov/pubmed/38004910
http://dx.doi.org/10.3390/mi14112053

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673209/
https://www.ncbi.nlm.nih.gov/pubmed/38004910
http://dx.doi.org/10.3390/mi14112053

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