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Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing
Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement sy...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673209/ https://www.ncbi.nlm.nih.gov/pubmed/38004910 http://dx.doi.org/10.3390/mi14112053 |
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author | Tian, Fangxin Wang, Tongqing Lu, Xinchun |
author_facet | Tian, Fangxin Wang, Tongqing Lu, Xinchun |
author_sort | Tian, Fangxin |
collection | PubMed |
description | Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement system was developed for a 12-inch CMP tool. Kinematic analysis of the scanning trajectory of the laser device indicated the relative position relationship between the device and the wafer. Average optical data within the wafer described the material removal of metal CMP. Furthermore, optical data and location described the non-uniformity of the entire wafer surface. In this research, the polishing condition and the residual of the wafer edge are characterized by optical trace. Pauta Criterion is used to discriminate the inflexion point of the material interface. The results reveal that the interface capture is accurate and effective. |
format | Online Article Text |
id | pubmed-10673209 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-106732092023-11-02 Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing Tian, Fangxin Wang, Tongqing Lu, Xinchun Micromachines (Basel) Article Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement system was developed for a 12-inch CMP tool. Kinematic analysis of the scanning trajectory of the laser device indicated the relative position relationship between the device and the wafer. Average optical data within the wafer described the material removal of metal CMP. Furthermore, optical data and location described the non-uniformity of the entire wafer surface. In this research, the polishing condition and the residual of the wafer edge are characterized by optical trace. Pauta Criterion is used to discriminate the inflexion point of the material interface. The results reveal that the interface capture is accurate and effective. MDPI 2023-11-02 /pmc/articles/PMC10673209/ /pubmed/38004910 http://dx.doi.org/10.3390/mi14112053 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Tian, Fangxin Wang, Tongqing Lu, Xinchun Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title | Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title_full | Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title_fullStr | Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title_full_unstemmed | Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title_short | Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing |
title_sort | endpoint detection based on optical method in chemical mechanical polishing |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673209/ https://www.ncbi.nlm.nih.gov/pubmed/38004910 http://dx.doi.org/10.3390/mi14112053 |
work_keys_str_mv | AT tianfangxin endpointdetectionbasedonopticalmethodinchemicalmechanicalpolishing AT wangtongqing endpointdetectionbasedonopticalmethodinchemicalmechanicalpolishing AT luxinchun endpointdetectionbasedonopticalmethodinchemicalmechanicalpolishing |