Effect of CoSn(3) nanocrystals on Sn3Ag plating for electronic packaging

Plating Sn3Ag on copper substrates represents a crucial electronic packaging technique. In this study, we propose a novel composite plating approach, wherein CoSn(3) nanocrystals are deposited within the Sn3Ag coating. The resulting reflowed Sn3Ag joints exhibit a range of distinctive properties. No...

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Detalles Bibliográficos
Autores principales: Wang, Jintao, Zhang, Luobin, Lv, ZiWen, Wang, Jianqiang, Zhang, Weiwei, Wang, Xinjie, Chen, Hongtao, Li, Mingyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673823/
https://www.ncbi.nlm.nih.gov/pubmed/38001161
http://dx.doi.org/10.1038/s41598-023-48159-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673823/
https://www.ncbi.nlm.nih.gov/pubmed/38001161
http://dx.doi.org/10.1038/s41598-023-48159-5

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