Effect of CoSn(3) nanocrystals on Sn3Ag plating for electronic packaging

Plating Sn3Ag on copper substrates represents a crucial electronic packaging technique. In this study, we propose a novel composite plating approach, wherein CoSn(3) nanocrystals are deposited within the Sn3Ag coating. The resulting reflowed Sn3Ag joints exhibit a range of distinctive properties. Notably, CoSn(3) nanocrystals dissolve in Sn during the reflow process, thereby lowering the supercooling required for Sn nucleation. Consequently, Sn crystals grow in six-fold cyclic twins. Additionally, the dissolution of Co atoms in Sn leads to a reduced solubility of Cu atoms in Sn, consequently lowering the supercooling required for the nucleation of Cu(6)Sn(5). Simultaneously, this phenomenon promotes the nucleation of Cu(6)Sn(5), resulting in a considerable precipitation of Cu(6)Sn(5) nanoparticles within the joints. Therefore, the mechanical properties of the joints are significantly enhanced, leading to a notable 20% increase in shear strength. Furthermore, the presence and distribution of Co elements within Sn induce changes in the growth pattern of interfacial Cu(6)Sn(5). The growth process of Cu(6)Sn(5) is dominated by the interfacial reaction, leading to its growth in a faceted shape. During the aging process, the dissolution of Co elements in Sn impedes the continuous growth of Cu(6)Sn(5) at the interface, causing Cu(6)Sn(5) to be distributed in the form of islands inside the joint. Remarkably, elemental Co acts as an inhibitor for the development of Cu(3)Sn and reduces the occurrence of Kirkendall voids.