Oriented Three-Dimensional Skeletons Assembled by Si(3)N(4) Nanowires/AlN Particles as Fillers for Improving Thermal Conductivity of Epoxy Composites

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have become of increasing interest. Traditionally, higher filler fractions are required to obtain a high thermal conductivity, but this leads to a decrease in the mechanical proper...

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Detalles Bibliográficos
Autores principales: Wang, Baokai, Wan, Shiqin, Niu, Mengyang, Li, Mengyi, Yu, Chang, Zhao, Zheng, Xuan, Weiwei, Yue, Ming, Cao, Wenbin, Wang, Qi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10675432/
https://www.ncbi.nlm.nih.gov/pubmed/38006153
http://dx.doi.org/10.3390/polym15224429

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10675432/
https://www.ncbi.nlm.nih.gov/pubmed/38006153
http://dx.doi.org/10.3390/polym15224429

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