Optimization of X-axis servo drive performance using PSO fuzzy control technique for double-axis dicing saw

The dicing saw is a critical piece of equipment in IC processing, primarily used to cut wafers. Due to the high spindle speed, even small errors in the cutting process can result in wafer chipping or cracking. Therefore, the dicing saw requires a high degree of accuracy and stability. In this paper,...

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Detalles Bibliográficos
Autores principales: Cao, Weifeng, Zhang, Peiyi, Mi, Qingtao, Sun, Yahui, Shi, Jun, Liang, Wanyong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10676367/
https://www.ncbi.nlm.nih.gov/pubmed/38007558
http://dx.doi.org/10.1038/s41598-023-47663-y

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10676367/
https://www.ncbi.nlm.nih.gov/pubmed/38007558
http://dx.doi.org/10.1038/s41598-023-47663-y

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