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Optimization of X-axis servo drive performance using PSO fuzzy control technique for double-axis dicing saw
The dicing saw is a critical piece of equipment in IC processing, primarily used to cut wafers. Due to the high spindle speed, even small errors in the cutting process can result in wafer chipping or cracking. Therefore, the dicing saw requires a high degree of accuracy and stability. In this paper,...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10676367/ https://www.ncbi.nlm.nih.gov/pubmed/38007558 http://dx.doi.org/10.1038/s41598-023-47663-y |