Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare...

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Detalles Bibliográficos
Autores principales: Tang, Lin, Ruan, Kunpeng, Liu, Xi, Tang, Yusheng, Zhang, Yali, Gu, Junwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Nature Singapore 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10689708/
https://www.ncbi.nlm.nih.gov/pubmed/38032407
http://dx.doi.org/10.1007/s40820-023-01257-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10689708/
https://www.ncbi.nlm.nih.gov/pubmed/38032407
http://dx.doi.org/10.1007/s40820-023-01257-5

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