Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

Detalles Bibliográficos
Autores principales: Ko, Wen-Yin, Chen, Wei-Hung, Cheng, Ching-Yuan, Lin, Kuan-Jiuh
Formato: Texto
Lenguaje:English
Publicado: Springer 2010
Materias:
Correction
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893851/
https://www.ncbi.nlm.nih.gov/pubmed/20672121
http://dx.doi.org/10.1007/s11671-010-9539-8

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893851/
https://www.ncbi.nlm.nih.gov/pubmed/20672121
http://dx.doi.org/10.1007/s11671-010-9539-8

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